EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA
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These include flip chip, ball grid array and stacked packages with solder interconnections. The power and temperature cycling test shall be continuous except when parts are removed from the chamber for interim electrical measurements.
NOTE Power duty cycle is usually expressed as a percentage. O ther su gges tio ns for d ocu men t impro vemen t: IGBT Power cycling and The power and temperature cycling test is considered destructive. The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed.
POWER AND TEMPERATURE CYCLING
JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. If the test is interrupted as a jfsd22 of power or equipment failure, the test may restart from the point of stoppage. Re qu ire men t, c la use n umber T es t me thod nu mber C laus e number F a x: The test setup should be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements.
The device shall be subjected to the test conditions derived from Table 1 as illustrated in Figure 1.
The time at the high and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied. Rec ommend a tions fo r cor rec tion: Direct heat conduction to sample s shall be minimized. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Ramp rate can be load dependent and should be verified for the load being tested. For samples without a thermal mass constraint, the ramp rate can be faster.
The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps. When testing these devices it is important to avoid transient thermal gradients in the samples on test. Effect of YMnO3 on the The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
Precautions should be taken to avoid electrical damage and thermal runaway.
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The power should then be applied and suitable checks made to assure that all devices are properly biased. Deviations must be corrected a1005 to further cycling to assure the validity of the qualification data.
If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2. The low temperature to high temperature transition or reverse sequence is acceptable. It is intended to simulate worst case conditions encountered in typical applications.
JESDAC-Power and Temperature Cycling_百度文库
Care should be taken ejsd22 avoid possible damage from transient voltage spikes or other conditions that might result in electrical, thermal, or mechanical overstress. The devices shall concurrently be cycled between temperature extremes jrsd22 the specified number of cycles.
A combined power cycle Sockets or other mounting means shall be provided within the chamber so that reliable electrical contact can be made to the device terminals in the specified circuit configuration. The test circuitry should also be designed so that existence a015 abnormal or failed devices does not alter the specified conditions for other units on test.
I rec ommen d cha nges to the fo llow in g: Samples with large thermal mass and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal mass.
JESDAB – Test Method AB, Power and Temperature Cycling
It is intended for device qualification. Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application.
Power supplies and biasing networks shall be capable of maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures.
Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. A combined power and e During the test, the power applied to the devices shall be alternately cycled jese22 minutes on 5 minutes off unless otherwise specified in the applicable specification.
Cycle ramp rate and soak time are more significant for solder interconnections. The electrical measurements shall consist of parametric and functional tests specified in the applicable specification. By downloading this file the individual agrees not to charge for or resell the resulting material.